牌号 | BR® 624 |
厂家 | Cytec Industries Inc. |
分类 | 环氧 |
介绍 | BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 to 350°F (-57 to 177°C). BR 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material. Suggested Applications: Insert and edge filling of honeycomb structures |
Cytec Industries Inc. 产品展示 | 种类 |
---|---|
DAPCO™ 3003 | 环氧 |
CYCOM® 997 | 环氧 |
CONAP® AD-7409 | 环氧 |
CONAPOXY® FR-1272 | 环氧 |
CYCOM® 7668 | 环氧 |
FM® 490A | 环氧 |
MTM® 49-3 | 环氧 |
FM® 385 | 环氧 |
DAPCO™ 3050 | 环氧 |
VTA® 260 | 环氧 |
订购说明