牌号 | EPO-TEK® H37-MPT |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly. |
Epoxy Technology Inc. 产品展示 | 种类 |
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EPO-TEK® OG142-112 | 环氧 |
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EPO-TEK® T6067-3 | 环氧 |
EPO-TEK® EE165-3 | 环氧 |
EPO-TEK® H44 | 环氧 |
EPO-TEK® H74F | 环氧 |
EPO-TEK® 353ND-T1 | 环氧 |
EPO-TEK® 353ND-T4 | 环氧 |
EPO-TEK® OD2003-LH Premium | 环氧 |
EPO-TEK® H20E-FC | 环氧 |
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