牌号 | EPO-TEK® H37-MPT |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly. |
Epoxy Technology Inc. 产品展示 | 种类 |
---|---|
EPO-TEK® B9101-2 Unfilled | 环氧 |
EPO-TEK® 353ND-LH Premium | 环氧 |
EPO-TEK® EK1000-1MP | 环氧 |
EPO-TEK® 730-110 Black | 环氧 |
EPO-TEK® H65-175MP | 环氧 |
EPO-TEK® M10-D | 环氧 |
EPO-TEK® TJ2183-LH | 环氧 |
EPO-TEK® OG142-95 | 环氧 |
EPO-TEK® T6067-3 | 环氧 |
EPO-TEK® H20E-MP | 环氧 |
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