牌号 | EPO-TEK® H67MP-GB |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads. |
Epoxy Technology Inc. 产品展示 | 种类 |
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EPO-TEK® 302-3M-Black | 环氧 |
EPO-TEK® 323LP-LH Ultra | 环氧 |
EPO-TEK® EM127 | 环氧 |
EPO-TEK® 353ND Black | 环氧 |
EPO-TEK® 320NC | 环氧 |
EPO-TEK® ED1020 | 环氧 |
EPO-TEK® EJ2189-LV | 环氧 |
EPO-TEK® 320 | 环氧 |
EPO-TEK® 375-T | 环氧 |
EPO-TEK® 353ND-T | 环氧 |
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