牌号 | FM® 6604-1 |
厂家 | Cytec Industries Inc. |
分类 | MAH-g |
介绍 | FM® 6604-1 is a modified bismaleimide (BMI) resin core splice foaming adhesive. It has a cure temperature of 350°F (177°C) with a post-cure at 440°C (227°C). The service temperature is -67°F to 450°F (-57°C to 232°C) with post-cure. Suggested Applications: Core shear-ties Edge closeouts Insert bonding |
Cytec Industries Inc. 产品展示 | 种类 |
---|---|
CYCOM® 5250-4 | MAH-g |
HTM® 552 | MAH-g |
FM® 6604-1 | MAH-g |
CYCOM® 5250-4 RTM | MAH-g |
HTA® 512 | MAH-g |
METLBOND® 2550 | MAH-g |
HTM® 512-1 | MAH-g |
HTM® 515-1 | MAH-g |
FM® 475 | MAH-g |
CORFIL® 5250-4 | MAH-g |
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