牌号 | METLBOND® 2550 |
厂家 | Cytec Industries Inc. |
分类 | MAH-g |
介绍 | Metlbond 2550 is a 350°F (177°C) cure, 440° (227°C) post-cure, modified BMI film adhesive with good high-temperature adhesive properties for bonding composites, metals and sandwich structures. Suggested Applications: Honeycomb sandwich bonding Metal-to-metal bonding Metal-to-composite bonding Composite-to-composite bonding |
Cytec Industries Inc. 产品展示 | 种类 |
---|---|
FM® 450-1 | MAH-g |
FM® 475 | MAH-g |
HTM® 515-1 | MAH-g |
METLBOND® 2550 | MAH-g |
CORFIL® 5250-4 | MAH-g |
CYCOM® 5250-4 RTM | MAH-g |
HTM® 512-1 | MAH-g |
FM® 6604-1 | MAH-g |
HTA® 512 | MAH-g |
HTM® 556 | MAH-g |
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